Top 6 Best Amtech

Rosin-based, low activity no-clean tacky solder flux specifically designed for hand-operations with leaded alloys - manual SnPb rework, stencil hand-printing and tinlead BGA reballing. Suitable for any level of training, with any basic, readily available amateur soldering tools. Fills the workspace with distinctive pleasant pine scent -  has been a prime choice for electronics and automotive repair industry for a decade.. Mighty action - a noticeable booster for copper ions while wicking the workspace. High temp - quickly breaks-up lead-free joints for further leaded repair without losing properties up to 300C600F. Exceptional wetting - takes over tinlead alloy, puts an operator in control. Excellent tackiness - holds components in-place allowing easy repositioning using technics like dancing a component with hot air. Long process window - continue a project later, once heated the flux will flow again.. Optimal viscosity - 36-48 Malcom 10 RPM25C x103mPas allowing smooth flow from a syringe. Halide-free 0.05. Surface insulation resistant. No copper mirror breakthrough. Low electrochemical migration 1 decade drop. Loaded with fire-retardant properties step-activated as heat increases - soldering Sn10Pb88Ag2 is no different from Sn63Pb37 although alloys operate within 100C difference.. ROL0 classification - non-corrosive, doesn't short components, can be left on board for multiple SMT assemblies manufacturer recommends cleaning all flux residues at all times to avoid board contamination or voltage leakage on circuits with high impedance, also non-activated residue may absorb moisture from air and subsequently cause corrosion. Clear residue can be easily removed with hot air, foam swab and basic solvents like d-limonene or isopropanol.. Industrial air-syringe intended for professional use with pneumatic dispensing machines, do not remove the piston stopper Do not discard original nozzle cap, tighten the cap while not using the flux - flux may dry out upon extended contact with air. Use supplied dispensing tip and plunger to manually control the flow. Keep in a room temperature - do not refrigerate. Genuine product made in the USA by AMTECH MANUFACTURING LLC, every original shipment includes AMTECH Soldering Profiles card..

ROL0 flux classification - rosin based, low activity no-clean tacky solder flux for professionalindustrial use. Highly praised by advanced reworks community for mighty long-lasting action and easy cleaning - clear residue evaporates with hot air and doesn't short components. Applicable for a syringe, stencil printing, rework, BGA sphere attachment and reballing using standard tinlead alloys not designed for lead-free. Halide-free 0.05. Contains UV-tracer for fast detection of splatter. Optimal viscosity - 40-52 Malcom 10 RPM25C x103mPas. High temperature compatible up to 300C600F. Surface insulation resistant. No copper mirror breakthrough. Low electrochemical migration 1 decade drop.. Wide process window - excellent performance on Flip Chip bumping and Chip Scale packaging sites. Activated residue is clear and non-corrosive - can be left on board for multiple SMT assemblies manufacturer recommends cleaning all flux residues at all times to avoid board contamination or voltage leakage on circuits with high impedance, also non-activated residue may absorb moisture from air and subsequently cause corrosion.. Industrial air syringe is intended for pneumatic dispensing machines, the flux is trapped inside with a piston stopper - do not remove the piston as it seals the flux from the air. Do not discard original nozzle cap, tighten the cap inside the nozzle while not using the flux. Use supplied blunt metal dispensing tip and plunger to manually control the flow.. Genuine product made in the USA by AMTECH MANUFACTURING LLC. Every original shipment would include AMTECH Soldering Profiles card..

Rosin-based, low activity no-clean tacky solder flux specifically designed for hand-operations with leaded alloys - manual SnPb rework, stencil hand-printing and tinlead BGA reballing. Suitable for any level of training, with any basic, readily available amateur soldering tools. Fills the workspace with distinctive pleasant pine scent -  has been a prime choice for electronics and automotive repair industry for a decade.. Mighty action - a noticeable booster for copper ions while wicking the workspace. High temp - quickly breaks-up lead-free joints for further leaded repair without losing properties up to 300C600F. Exceptional wetting - tames tinlead alloy, puts an operator in control. Excellent tackiness - holds components in-place yet allowing an easy repositioning using technics like dancing a component with hot air. Long process window - continue a project later, once heated the flux will flow again.. Optimal viscosity - 40-52 Malcom 10 RPM25C x103mPas allowing smooth flow from a syringe. Halide-free 0.05. Surface insulation resistant. No copper mirror breakthrough. Low electrochemical migration 1 decade drop. Loaded with fire-retardant properties step-activated or curtailed as heat increases or subsides - soldering Sn10Pb88Ag2 is no different from Sn62Pb37 although alloys operate within 100C range difference.. ROL0 classification - non-corrosive, doesn't short components, can be left on board for multiple SMT assemblies manufacturer recommends cleaning all flux residues at all times to avoid board contamination or voltage leakage on circuits with high impedance, also non-activated residue may absorb moisture from air and subsequently cause corrosion. Clear residue can be easily removed with hot air, foam swab and basic solvents like d-limonene or isopropanol.. Industrial air-syringe intended for professional use with pneumatic dispensing machines, do not remove the piston stopper Do not discard original nozzle cap, tighten the cap while not using the flux - flux may dry out upon extended contact with air. Use supplied dispensing tip and plunger to manually control the flow. Keep in a room temperature - do not refrigerate. Genuine product made in the USA by AMTECH MANUFACTURING LLC, every original shipment includes AMTECH Soldering Profiles card..

ROL0 flux classification - rosin based, low activity no-clean tacky solder flux for professionalindustrial use. The most recent and the most up-to-date no-clean tacky flux formulation by AMTECH. VS-213A-TF is REACH compliant, halogen-free and universal - a no-clean flux for demands of XXI century. Halide-free 0.05. Glows in UV light for fast detection of splatter. A record low voiding among all AMTECH no-clean fluxes. Industrial viscosity - 40-65 Malcom 10 RPM25C x103mPas. Compatible with leaded andor lead-free alloy systems up to 250C500F. Surface insulation resistant. No copper mirror breakthrough. Low electrochemical migration 1 decade drop no-clean. REACH compliant, meets and exceeds the most rigorous requirements and militaryavionics specifications.. Activated residue is clear and non-corrosive - can be left on board for multiple SMT assemblies manufacturer recommends cleaning all flux residues at all times to avoid board contamination or voltage leakage on circuits with high impedance, also non-activated residue may absorb moisture from the air and subsequently cause corrosion.. Industrial air syringe is intended for pneumatic dispensing machines, the flux is trapped inside with a piston stopper - do not remove the piston as it seals the flux from the air. Do not discard original nozzle cap, tighten the cap inside the nozzle while not using the flux. Use supplied blunt metal dispensing tip and plunger to manually control the flow.. Genuine product made in the USA by AMTECH MANUFACTURING LLC. Every original shipment would include AMTECH Soldering Profiles card..

Soldering Flux. Smooth Flow. Solder Flux. Halogen Free.

1. A traditional classic model flux paste, using hydrogenated rosin for and a variety of active agents made of high-temperature mixing.. 2. Halogen-free, viscous general, yellow color, transparent residue after welding.. 3. To help soldering quickly on the tin, reduce the damage to the components of high-temperature welding, BGA tin planting can stick to the tin ball, so that the solder joints full, bright.. 4. Used for conventional components welding or desoldering circuit board components.. 5. Each support solder paste net content of 10ML. Each support solder paste with 5 push rod and 10 needles..

Rosin-based, low activity solder flux ROL0.. No-clean designation.. Not corrosive.. Clear residue.. Includes card with soldering profiles.

Contains Two levels of protection- Two Active Ingredients to fight corrosion,rust and scale. Formulated to Prevent Rust Scale, Safe for Stainless Mild Steel. Dramatically Reduces Sludge Mineral Deposits. Protects Copper and Brass. Made in the USA.