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Permatex 21351 Electrically Conductive Rear Window Defogger Tab Adhesive, Single Unit
Quickly and easily bonds defogger tab to grid on rear window. Provides a low-cost, high-quality repair for damaged rear window defogger tabs. Complete kit for a quick repair. Resistant to extreme weather conditions. Suggested Applications Rear window defogger tabs.
Low Cost, Low Volume Resist, Electrically Conductive Silver Epoxy Adhesive, AA-Duct 906, 2.5gm kit
Best for Most Electronics Applications. For greater conductivity use AA-DUCT 902. Easy to use Single Use Pouch. Mix in packet and use.. Unbeatable Strength. Bonds well to glass, metals, fabrics, wood and many other substrates. Hardens at room temp in 24 hours 1 hour work time. Made in USA - Reach, RoHS and Conflict mineral compliant.
GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance
Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.. Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.. It has good thermal conductivity and wide service temperature range-60250 degrees Celsius. Thermal conductivity 1.5Wm-K, Do not use thermal glue between CPU and HEATSINK. Package Includes 1 x GENNEL G109 10g thermal glue.
Zehhe Copper Foil Tape with Double-Sided Conductive - EMI Shielding,Stained Glass,Soldering,Electrical Repairs,Paper Circuits,Grounding (1/4inch)
CONDUCTIVE ADHESIVE Double-sided Conductive means both sides of this tape will carry current so whether it's soldering, grounding or minor repairs, our tape will do the job, and do it well.The tape is also ideal for transformer, mobile phone, computer, PDA, PDP, and LCD monitor, PC, copier etc. PERFECT FOR STAINED GLASS MAKERS Our tape has strong adhesive and is a great surface for soldering onto when creating your stained glass pieces.21.8yards has quick peal paper backing, making it easier to work with and providing a neater finish. GREAT FOR EDUCATION AND CRAFTS The tape is an ideal size for creating paper circuits, a fun and easy way to introduce children to electronics. Malleable tape with strong adhesive can be moulded to most surfaces giving unlimited potential for craft projects. EMI SHIELDING If you want to protect your small electronics from electromagnetic interference, our highly conductive tape is the quick and easy solution. BE ATTENTION Safety overrides all else , i hope you guys do it carefully no matter where the tape will be used in.
2 Pack 10g (20g in Total) HY910 0.975W/m-k Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for LED GPU MOSFET 3D Printer IC Chipset
High Thermal Conductivity - With a thermal conductivity rate of 0.975Wm-K, this thermal conductive glue helps disperse heat effectively from MOSFETs, LEDs, ICs, GPU chipsets, and other electronic components that require direct bonding. It is suitable for all heatsinks without a fixed clip, and can be used for a wide range of applications.. Safe and Non-Electrical Conductive - This thermal adhesive is non-electrical conductive, safe, and non-toxic, making it safe for both users and electronic components. It is odorless, moisture-resistant, and non-swelling, ensuring that it does not damage the substrate over time. Important it is important to note that this thermal glue should not be used between the CPU and heatsink.. Strong Adhesion - This thermal plaster features strong adhesion properties that allow it to bond with most metals and non-metals, ensuring a reliable and long-lasting connection. The adhesion and tensile strength is 2.1MPA, making it a high-performance option that delivers excellent results.. Quick Drying Time - This thermal adhesive cures quickly upon contact with air, with a drying time of approximately 30 minutes at 25. This makes it easy and convenient to apply, with minimal downtime required.. Wide Service Temperature Range - With a service temperature range of -60250 degrees Celsius, this thermal adhesive is suitable for use in a wide range of industries and applications. It has good thermal conductivity and stability, and is ideal for use in electrical appliances, instruments, and other industries that require effective heat dissipation..
MG Chemicals 8331D Silver Conductive Epoxy Adhesive, High Conductivity, 20 min Working time, 2-Part, 14 Gram Kit
Creates strong permanent electrical connections. Electrical resistivity 1.8 x 10-3 cm, Thermal conductivity 1.5 WmK.. Use as a solder replacement or for bonding heat-sensitive electronic components. Cures at room temperature but heat cure is recommended to get the best possible conductivity. Excellent adhesion to many substrates such as glass, soft metals and plastics. SVHC free.
Easycargo 10gram Thermal Conductive Glue Kit, High Performance Silicone Thermal Plaster Adhesive Glue, Cooler Epoxy Compound for Heatsink GPU VRM VRAM LED IC Chips MOSFET BJT Transistor 3D Printer PCB
10 gram high performance thermal glue with strong adhesion.. Thermal conductivity 0.975 wmk. Thermal Impedance 0.06. Non-Electrical Conductive. Premium thermal conductive glue for bonding the interface of cooler heatsink and GPU VRM VRAM PCB LED, BJT MOSFET transistor, Voltage regulator, IC Chips, etc.
MG Chemicals - 8329TFF-25ML 8329TFF Thermally Conductive Adhesive - Fast Cure Epoxy, 25 mL Dual Dispenser
Thermal conductivity of 0. 8 WmK. 11 mix ratio. Working life 4 minutes, set time 15 minutes. Cure time 3 hours at room temperature or 15 minutes at 65 c 149 f. Flame retardant UL 94V-0 registered.
Halnziye 10Gram Thermal Conductive Glue Silicone Plaster Viscous Adhesive Cooling Compound for LED GPU Chipset Heatsink
Do Not Use Thermal Glue Between CPU Chip And Heat Sink, use it within 24 hours once opened.. Thermal conductivity 1.2Wm-K. Strength of connected buildings 55 lb.. Features thermal properties, strong adhesion. Application apply to all heatsink no fixed clip thermal paste. Ideal for MOSFET Heatsink VGA CARD Northbridge Southbridge Heatsink..
Electrically Conductive Epoxy, Silver Adhesive, Room Temperature Cure, Air Dry AA-Duct 907, 5 gm kit
Spec. Gravity 2.79 gcc Cured, Viscosity Paste ot Life 30 min solids contents, 100. Mechanical Properties Hardness, Shore D 83 Adhesive. Shrinkage linear inin 0.003,Lap shear strength,psi 9400 Vol Resistivity ohm cm less than 0.0002. cure time 2 minutes AT 120C,5 minutes At 100C,12 hours At 25C. Mix Ratio, parts by weight 100100 ResinHardener.