Top 6 Best Low Melt Solder

Best Content Rationot that the higher the tin content, the better the solder wire,the best ratio is 6338 for use. Tin Lead Solder Wire Parameterssolder wire 6337,soldering wire with flux1.8,electrical soldering wire dia 0.8mm0.0315'',solder wire g.w 50g1.77oz,good size for pocket.. Rosin Core Solder Wire Featurelow melting point 361F184C,very good soldering capability,smoother welding process,soldering fast,strong soldering point and easier to use. Applicationstin lead rosin core solder wire for electrical devices,esp for radiostelevisionsvideo recordersstereo systemswires motorscircuit boards and other electronical devices etc. we have a professional service team, ready to provide the best service for each customer, look forward to the start of cooperation, if you have any questions, please feel free to contact us.

The Fast Chip SMD Removal Kit is a quick and inexpensive way to remove SMD components from a PCB without a hot air station using only your soldering iron.. Removes QFP's, PLCC's, SOIC's, and chip components under 300 degrees Fahrenheit. Enough material to remove 8-10 SMD'S. The Kit Contains 2.7 ft. Fast Chip Removal Alloy - 1 2cc tube of SRA TF5000 No Clean Rework Paste Flux and complete Instructions for SMD Removal and Cleanup.

4.5 ft of Low melting point alloy for IC removal.. Easily remove ICs without a Hot Air Station or Hot Air Gun.. Comes in convenient 6.5 lengths with instructions.. Indium alloy with very low melting point. No shelf life.. California Prop65 WARNING This product can expose you to lead, which is known to the state of California to cause cancer, birth defects, or reproductive harm. For more information, go to www.P65Warnings.ca.gov..

Low Melting alloy for IC removal. Easy way to remove IC's without a Hot Air Station. This is supplied in convenient 6.5 length pieces with Instructions.. No shelf life.

Low temperature solder paste with non clean flux. Melting point 138 C 280 F. The powder distribution complies with the j-std-005 type 3 with 80 percent min. Between 25-45 m particle sizes. Store refrigerated between 210 C 3550 F to minimize solvent evaporation, flux separation, and chemical activity. Bring the paste to room temperature prior to use. Rohs compliant.

Essmetuin Lead-Free Solder Paste Content Alloy Tin 42 Bi 57.6Ag0.4, Solder Flux Content 10.8. Lead-Free Solder Paste - Low Temperature Solder Paste With Flux, Melting Point 138 280.4F,Suitable For Paper Boards Or Soft Boards That Cannot Withstand High Temperatures, Special Welding Of Small Components.. Product Advantages Pushing-Type Design Smoother Flowing No Wasting During Welding. Widely Used In BGA SMD Circuit Board,Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors, Lighting, Connectors, ,SMT Maintenance. The Post Soldering Transparent Residues Are Non-Conductive, Non-Corrosive And Highly Insulated.

Smooth Flow. Low Temp Solder. Halogen Free. Lead-Free. RoHS Compliant.

Lower Melting Point 17680, Flow Smoothly,Fast Melting Speed. Work With Low-Melting, Which Can Protect The Chip Kit, SMD. Suitable For Quick Removal Chip Kit, SMD, QFP, PLCC,SOIC, Under 300 degrees Fahrenheit. Free Of Rosin FluxNeed To Use With Flux. WarningThis Product Contains Lead, A Substance Known To The State Of California To Cause Cancer Or Birth DE-Fects Or Other Reproductive Toxicity. For More Information, Go To WWW.P65WARNINGS.CA.GOV.

Smooth Flow. Low Temp Solder. Halogen Free. Lead-free. RoHS Compliant.