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Wonderway Sn42/Bi58 Tin Lead Free Solder Paste 138 Melting Point No-Clean Welding Soldering Tin For Electronics PCB IC CELLPHONE CPU LED BGA Repairing (20g)
Paste Content Alloy Tin 42 Bi58 , Sloder Flux Content 10.5. Product Parameters Total Weight 29g, Net Weight Of Paste 20g. Paste Features No Clean, Strong Viscosity, Bright Welding Point. Product Advantages Pushing design for Smoother Flowing, No Waste During Welding. Applications Widely Used In Circuit Board, IC, Phone, TV and Other Household Appliances and Industrial Equipment.
Chip Quik SMD291AX50T3 Solder Paste in jar 50g (T3) Sn63/Pb37 no clean
Essmetuin Sn62.8Pb36.8Ag0.4 183 Melting Point Solder Paste, No-Clean Tin Lead Cream, Solder Flux Paste For PCB/IC/BGA/SMD CELLPHONE CPU Repairing(30G)
Essmetuin Solder Paste Content Alloy Tin 62.8 Pb 36.8Ag0.4, Solder Flux Content 10.8. Lead-Containing Solder Paste - Medium Temperature Solder Paste With Flux, Melting Point 183 361F. Product Advantages Pushing-Type Design Smoother Flowing No Wasting During Welding. Widely Used In BGA SMD Circuit Board,Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors, Lighting, Connectors, ,SMT Maintenance. WarningThis Product Contains Lead, A Substance Known To The State Of California To Cause Cancer Or Birth DE-Fects Or Other Reproductive Toxicity. For More Information, Go To WWW.P65WARNINGS.CA.GOV.
Wonderway Sn63/Pb37 Tin Lead Solder Paste 183 Melting Point No-Clean Welding Soldering Tin For Electronics PCB IC CELLPHONE CPU LED BGA Repairing (30g)
Paste Content Alloy Tin 63 Pb 37, Sloder Flux Content 10.5.. Product Parameters Total Weight 39g, Net Weight Of Paste 30g.. Paste Features No Clean, Strong Viscosity, Bright Welding Point.. Product Advantages Pushing design for Smoother Flowing, No Waste During Welding.. Applications Widely Used In Circuit Board, IC, Phone, TV and Other Household Appliances and Industrial Equipment..
Chip Quik SMD291AX Solder Paste no clean 63Sn/37Pb in 5cc syringe 15g
Solder Paste. Leaded. No Clean. Syringe.
2 Jar Solder Flux, Flux for Soldering, Rosin Soldering Flux Paste for Lead-Free Electronics Soldering and Soldering DIY (1.2oz/35g in a Jar)
ENOUGHT QUANTITY The package includes 2 jars of soldering flux. A total of 70 g. Enough quantity for your use.. NON-CORROSIVE Rosin is not conductive in dry conditions and has good insulation. Is not corrosive to metal substances such as circuit boards.. OXIDATION RESISTANCE Anti-oxidation effect on soldering iron head of gold-copper alloy substrate. Solder flux for semi-solid, not easy to dump.. STRONG APPLICABILITY Flux is suitable for welding instruments, gold, copper, tin, iron and other metals. Ideal for electronic welding, repair and rework.. WHAT YOU GET Rosin soldering flux paste 2, our 724 friendly customer service for peace of mind..
Chip Quik NC191LTA10 Smooth Flow Low Temp Solder Paste Sn42/Bi57/Ag1 T4 10g Syringe
Solder Paste.
Chip Quik SMDLTLFP Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F
Solder Paste. Lead Free RoHS. No Clean. Syringe. Low Temprature.
Chip Quik NC191LT10 Smooth Flow Low Temp Solder Paste Sn42/Bi57.6/Ag0.4 T4 10g Syringe
Smooth Flow. Low Temp Solder. Halogen Free. Lead-Free. RoHS Compliant.
Sookolr Leaded Solder Paste, Sn63/Pb37, Melting Point 183, No-Clean Solder Paste is Suitable for Electronic Components, BGA, IC Soldering (15g/0.53oz)
Leaded Solder Paste Features No-clean, Solid after soldering, bright solder joints, not easy to connect tin, good oxidation resistance. Product Information Alloy composition Sn63Pb37, Melting Point 183 NOTE The melting point of the solder paste, that is, to reach the temperature at which it melts, but not the temperature adjusted by the heat gun when welding, the specific adjustment temperature depends on the actual welding environment.. Pushing design for smoother flowing, Flexible control of tin output to avoid waste. Equipped with four different sizes of needles to facilitate the needs of different use scenarios. Application Widely used in circuit boards, integrated circuits and other fields. Suitable for electronic components, BGA, IC soldering. Product Weight 15g0.53oz.
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